Senior Engineer I-Packaging Jobs

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This position for a Package Development Engineer will entail all aspects of IC package development from initial design and performance considerations to package selection, design optimization, aligning design rules, completing package qualification, interfacing with subcon and internal assembly and reliability resources, and final release to production. A special emphasis of flip chip package development is desired and the successful candidate will demonstrate a full knowledge of all aspects of the flip chip package manufacturing process, including high-density substrate design and manufacture.

• This position is open to candidates in Burnaby (CA), Chandler (AZ) and San Francisco (CA)

Job Responsibilities
Responsibilities include but are not limited to the following:

• Oversee evaluation and development of new packaging materials and processes.
• Assist with global cost reduction, standardization, and new system implementation projects
• Develop and maintain the package and technology roadmap for MCHP with subcon partners.
• Manage qualification of new packages or changes to ensure quality and mitigate risk.
• Work closely with product development teams designing and developing next generation silicon solutions for the business unit and co-develop optimized packaging solutions that meets all the required internal and customer quality and performance specifications, as well as specific mechanical, reliability, and electrical requirements while maintaining design for manufacturability in a high-volume manufacturing environment.
• Initiate and follow up on assembly build instructions for all engineering builds.
• Ensure early success in package development with substantial modeling and simulation for thermal and mechanical both during design and prototyping phases of the development process.
• Interface with Microchip’s sub-contracted manufacturing partners to align design rules, DFM, FMEA, and overall compatibility with the manufacturing process, and guide them on upcoming packaging needs being driven by MCHP and its customers.

Requirements/Qualifications

• Travel to Asia occasionally to attend technology reviews and resolve subcon issues
• Ability to carry on multiple projects, set timelines and prioritize projects
• Superior communication and presentation skills and the ability to lead a small team as needed including mentoring junior engineers
• Ability to assist the reliability group on FA’s on assembly related failures
• Ability to think creatively to solve complex problems and offer cost-effective solutions
• Excellent understanding of qualification standards and failure mechanisms in flip chip packaging
• Meticulous attention to detail
• Ability to draft and comprehend engineering drawings
• Experience with advanced laminate (BGA) package design and assembly
• 10+ years of experience
• Well-developed knowledge of thermal & electrical simulations, ideally Ansys Workbench and Flotherm tools

Travel Time
0% - 25%