Principal Engineer- Packaging Jobs

Are you looking for a unique opportunity to be a part of something great? Want to join a 20,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology, Inc.
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Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.
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The successful candidate will engage in the following duties:

• Define flows for signal, power and thermal analysis for advanced packaging- includes working with EDA vendors to determine best tools and flows for our designs.
• Work with design teams to determine best Advanced Packaging technology for Microchip's products.
• Work closely with design and architecture teams to achieve best possible outcomes on power, signal and thermals for given design.

This position requires someone comfortable with the many aspects of advanced packaging for
Microchip products, and who enjoys the challenge of leading integration driven innovations across
geographically disperse teams in pursuit of taking advantage of Advanced Packaging
Requirements/Qualifications
Education:

• Must have a Bachelors in Electrical Engineering, Mechanical Engineering, Materials Science or Physics (Masters or PhD preferred)
• Must have 8.5+ years’ experience in packaging with special emphasis on Advanced Packaging

Job Requirements

• Ideally has broad knowledge of 3D and heterogeneous assembly technology - HBM/CoWoS and others
• Self-motivated, attention to detail, ability to prepare technical reports by collecting, analyzing, and summarizing information, as well as write technical specifications and procedures
• Excellent written and verbal communication skills and ability to work as a team player in a fastpaced environment. Good presentation skills.
• Ability to problem solve and work with Die team to iterate through the package design process
• Experience with Advanced Packaging concept and technologies
• Experience with Advanced Packaging reliability, modelling and testing
• Excellent time management skills
• Ability to run Signal Integrity and Power Integrity simulations
• Well-developed knowledge of thermal and electrical simulations, ideally Ansys Workbench,Flotherm.
• A thorough understanding of semiconductor physics and various semiconductor processes is a plus
• Experience with package routing and layout using Cadence APD or similar tools

Travel Time
0% - 25%