Asic Packaging Engineer Jobs

WHAT YOU DO AT AMD CHANGES EVERYTHING
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The Role
Design packaging architectures for all of AMD chips.
The Person
The ideal candidate will like to learn in a dynamic environment and work with cross functional teams.
Key Responsibilities

• Interacting with Assembly houses and substrate vendors to achieve the most cost efficient design and yield requirements.
• Designs that meet objectives with regards to performance, cost and quality.
• Layout for AMD products, probe cards and test vehicles on schedule and meet the design objectives.

Preferred Experience
Package Design and/or ASIC Chip Design.
Knowledge on using CAD tools such as Cadence SIP, APD, AUTOCAD and ICC2
Knowledge on Perl Script Programming, a plus.
Experience dealing with assembly and substrate subcontractors.
Excellent communication and organizational skills.
Team player and must be able to work well with others.
Education Requirements
B.A. Sc. in Electrical Engineering, Computer Engineering, or Engineering Science.
Location: Markham, Canada
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.